High Density Electronics Center (HiDEC)
The University of Arkansas’s (UA) High Density Electronics Center (HiDEC) came into existence in the early 1990s through a large federal grant. It was designed to lead national research in the fabrication of multichip modules. Since that time, it has evolved into a facility that serves the research and development interest of the UA and many industries, crossing discipline boundaries to become a significant force for multidisciplinary and university industry collaborations.
Based on the staff’s capability and commitment for operations, development, maintenance, and training, HiDEC enables research groups with electronic relevant interests to pursue and prepare themselves for the most cutting edge research and development in electronics. HiDEC houses laboratories for low temperature co-fired ceramic (LTCC) processing, electronic assembly, electrical characterization, and reliability testing.
If you’re interested in accessing this facility, you may qualify for a voucher to cover facility costs. Visit Research Vouchers – Arkansas INBRE to check your project’s eligibility.
Analytical Lab
- Nordson Dage 4000 Multipurpose Bondtester
- Buehler Ecomet4 Polisher with Automet 2 Powerhead
- Dektak 3030 profilometer
- Despatch LEY1-55H Series Humidity Environmental Test Chamber
- Anatech Hummer VI A SEM Sputter Coater
- Exact dispensing vacuum encapsulation
- VWR FM1350 box ovens
- Zeiss AX10 stereomicroscope
- Buehler Isomet low speed saw
- Logitech PM5 polisher
Assembly Laboratory
- Diener electronic PICO 5
- Finetech Sigma 2406 Die Bonder
- Fisher Isotemp 281A Vacuum Oven
- Heidenhain VRZ 760B digital micrometer
- Hesse BJ935 Heavy Aluminum Wire Bonder
- Kulicke & Soffa Industries 4523 Wedge Bonder
- Kulicke & Soffa Industries Model 4700 Combination Wedge/Ball Wire Bonder
- Orthodyne Model 20 Wire Bonder
- Sikama 5/C Reflow Oven
- SST 3130HT Brazing furnace
- SST 5100 Vacuum reflow oven
Low temperature co-fired ceramic (LTCC) Equipment
- PTC CS-MLC Hot Knife Cutter
- Thermo Scientific 55.3L Box Furnace
- Microtec 550TVC Screen printer
- HMI MSP-9156 Screen printer
- USHIO 8200Z SL Automatic Puncher
- Avure Technologies IL142005_SS isostatic laminator
- Amerimade acid wet bench
- Suss MJB3 aligner
- Specialty Vacuum PV1 E-beam evaporator
- Disco DAD-341 silicon dicing saw
- ADT 7100 ceramic dicing saw
Reliability Equipment
- Delta Design 9023 Environmental Test Chamber
- Delta Design 9059 Environmental Test Chamber
- Despatch 16000 Series Oven
- Hirayam PC-305S Pressure Cooker
- Tabai liquid bath type thermal shock chamber TSB-1L
Micro-Machining Laboratory
- Microlux Diamond Band Saw
- Diamond Tech 2-in-1 glass grinder
- Buehler Surfmet I grinder
- Buehler Ecomet 250 polisher
- Sieg 3501 CNC
- Retsch PM 200 ball mill
- Sieg C3 mini-lathe
- Bauer benchtop bandsaw
- Rikon #30-120 13” drill press
- Tormach PCNC 440 CNC
- Tormach 1100M CNC
- Sieg X2D mini mill
- Ozo 18 HS router