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High Density Electronics Center (HiDEC)

The University of Arkansas’s (UA) High Density Electronics Center (HiDEC) came into existence in the early 1990s through a large federal grant. It was designed to lead national research in the fabrication of multichip modules. Since that time, it has evolved into a facility that serves the research and development interest of the UA and many industries, crossing discipline boundaries to become a significant force for multidisciplinary and university industry collaborations.

Based on the staff’s capability and commitment for operations, development, maintenance, and training, HiDEC enables research groups with electronic relevant interests to pursue and prepare themselves for the most cutting edge research and development in electronics. HiDEC houses laboratories for low temperature co-fired ceramic (LTCC) processing, electronic assembly, electrical characterization, and reliability testing.

Analytical Laboratory

The Analytical Lab (ENRC 4308 ) houses metrology, machining and cross sectioning tooling for post evaluation of substrates and modules developed in either the LTCC or power assembly laboratory.
    •     SIEG 3501 CNC Milling Machine
    •     Nordson Dage 4000 Multipurpose Bondtester
    •     Buehler Ecomet4 Polisher with Automet 2 Powerhead
    •     Dektak 3030 profilometer
    •     Despatch LEY1-55H Series Humidity Environmental Test Chamber
    •     Anatech Hummer VI A SEM Sputter Coater
    •     Tormach 1100M CNC Milling Machine

Assembly Laboratory

The Assembly Lab (ENRC 4802 ) houses solder reflow, die attach and wire bond tooling for all electronic assembly needs.
    •     Diener electronic PICO 5
    •     Exact Dispensing VC 18 Vacuum Chamber System
    •     Finetech Sigma 2406 Die Bonder
    •     Fisher Isotemp 281A Vacuum Oven
    •     Heidenhain VRZ 760B digital micrometer
    •     Hesse BJ935 Heavy Aluminum Wire Bonder
    •     Kulicke & Soffa Industries 4523 Wedge Bonder
    •     Kulicke & Soffa Industries Model 4700 Combination Wedge/Ball Wire Bonder
    •     Orthodyne Model 20 Wire Bonder
    •     Sikama 5/C Reflow Oven
    •     SST 3130HT Brazing furnace
    •     SST 5100 Vacuum reflow oven

Low temperature co-fired ceramic (LTCC) Equipment

LTCC (HDEC ) houses punch, print, in-situ metrology, collate, laminate and firing tooling. The facility also holds wet etch, dry etch and dicing capabilities.
    •     PTC CS-MLC Hot Knife Cutter
    •     Thermo Scientific 55.3L Box Furnace
    •     Microtec 550TVC Screen printer
    •     HMI MSP-885 Screen Printer
    •     USHIO MP4150SL Automatic Puncher
    •     USHIO 5200Z SL Automatic Puncher
    •     USHIO 8200Z SL Automatic Puncher
    •     Baccini punch tool
    •     Baccini collate tool
    •     Avure Technologies IL142005_SS isostatic laminator

Reliability Equipment

The Reliability Lab (ENRC 4312 ) houses environmental test equipment and thermal shock tooling for all electronic assembly needs.
    •     Delta Design 9023 Environmental Test Chamber
    •     Delta Design 9059 Environmental Test Chamber
    •     Despatch 16000 Series Oven
    •     Hirayam PC-305S Pressure Cooker
    •     Tabai liquid bath type thermal shock chamber TSB-1L